In Win Development Inc. (InWin) has announced its new flagship full-tower PC case, COVALENT, designed for professional environments that require high performance. This modular case combines robust structural integrity with exceptional thermal management, designed to support consistently high-demand workloads for both workstations and passionate users.

Main Highlights

  • Target Audience: AI and multi-GPU workstation builds, high-performance computing.
  • Design Options: Available with tempered glass or solid metal side panels.
  • Motherboard Support: Supports EEB (12″ x 13″) and rear-connected motherboards.
  • Expansion: Offers eight PCIe slots (horizontal and vertical) for flexible GPU mounting.
  • Cooling Capacity: Supports two 420mm radiators and thirteen fans, comes with four pre-installed CV140 fans.
  • Storage: Offers modular options for 3.5″ and 2.5″ devices.
  • Build Features: Equipped with a reinforced steel structure, dedicated PSU chamber, tool-less panels, and USB 3.2 Gen 2×2 Type-C front I/O.

Performance and Versatility

The COVALENT case is available in two different configurations, with a tempered glass side panel to showcase internal components and ARGB lighting, or with solid metal panels for a more understated aesthetic. The front panel features a vertically slotted design to maximize airflow, providing continuous cooling during intensive tasks.

Designed for Heavy Loads

Designed with workstation-class components in mind, the COVALENT supports EEB (12″ x 13″) and rear-connected motherboards. Its spacious interior is optimized for multi-GPU setups, offering eight PCIe slots that allow for both horizontal and vertical GPU mounting. The reinforced steel structure and optional GPU support brackets provide long-term stability for heavy graphics cards.

Optimized Thermal Management

For AI and high-performance computing environments, the COVALENT features an airflow-optimized design that can accommodate two 420mm radiators and thirteen fans. It comes with four pre-installed CV140 fans (three front, one rear) to ensure balanced cooling out of the box, providing stable thermal performance even in high power consumption configurations.

Modular Design and Professional Features

The case offers flexible storage solutions for 3.5″ and 2.5″ devices and can be expanded with optional brackets. Its modular internal layout accommodates various loads. Additional professional features include a dedicated PSU chamber, tool-less panels for easy maintenance, USB 3.2 Gen 2×2 Type-C front I/O, and an integrated fan hub that supports comprehensive cable management for a clean build.

InWin has not yet announced pricing or specific retail availability for the COVALENT case, but it is expected to be released in the first quarter of 2023.